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PCB impedance calculator

Characteristic and differential impedance for the six common PCB line structures, with effective dielectric constant and propagation delay. Presets use the published JLCPCB and OSH Park 4-layer stackups.

Units
Presets
mm
mm
Microstrip and CPWG: trace to plane. Stripline: plane to plane (b).
mm
1 oz is 0.035 mm (1.378 mil).
Characteristic impedance, Z0
51.7Ω
w 0.35 mmh 0.21 mmt 0.035 mmεr 4.4Surface microstrip, plane belowZ0 51.7 Ω
Cross-section, to scale.
Effective dielectric constant
3.17
Propagation delay
5.94 ps/mm
Z0 against trace width, other inputs fixed
405060700.20.30.40.50.60.7Trace width (mm)Z0 (Ω)
Method

How this is calculated

Microstrip     Hammerstad and Jensen (1980), u = w/h widened for copper thickness t
               Z0 = Z01(u) / √εe(u),  εeff from the same model (see Microstrip note)
Pair Z0        Z0 = 87 / √(εr + 1.41) · ln( 5.98h / (0.8w + t) )   (IPC-2141)
Embedded       εr′ = εr · (1 − e^(−1.55 h1 / h))
               Z0 = 60 / √εr′ · ln( 5.98h / (0.8w + t) )
Stripline      Z0 = 60 / √εr · ln( 4b / (0.67π (0.8w + t)) ),  b = plane to plane
Diff. micro.   Zdiff = 2 Z0 · (1 − 0.48 e^(−0.96 s/h))
Diff. strip.   Zdiff = 2 Z0 · (1 − 0.347 e^(−2.9 s/b))
CPWG           k = w/(w + 2g),  k3 = tanh(πw/4h) / tanh(π(w + 2g)/4h)
               εeff = (R(k) + εr R(k3)) / (R(k) + R(k3)),  R(k) = K(k)/K(k′)
               Z0 = 60π / ( √εeff · (R(k) + R(k3)) )
Delay = √εeff / c
Valid range
Surface microstrip: the Hammerstad and Jensen model covers the usual PCB range of w/h and εr without a stated cut-off here. Microstrip pairs and embedded: 0.1 < w/h < 3.0 and 1 < εr < 15. Stripline: t/h < 0.25 (h trace to plane) and w/(b − t) < 0.35 (b plane to plane). Outside these the result is marked.
Microstrip
Surface microstrip uses Hammerstad and Jensen (1980) with the copper-thickness correction. Its effective εr matches TI SCAA082A Table 2 within 0.05 %. Its Z0 is within about 1 % of a 2D field solver on 0.1 to 0.35 mm lines over 0.2 mm FR-4. The IPC-2141 form used before read 3.5 to 6 % low there.
Accuracy
Stripline (IPC-2141) is within 1 % of a 2D field solver over most of its valid range, w/(b − t) below 0.35, and more than 30 % off below 0.05 (LearnEMC). Pairs: see below.
Pairs, coupling
Differential stripline uses the IPC-2141 coupling constant 0.347; some tools print 0.374, which reads 0.7 to 1.2 % lower on typical pairs.
Embedded
The εr′ form above (IPC-D-317A) is the one most PCB tools adopted. A primary copy of it could not be checked, and no field-solver accuracy figures are published for it here. LearnEMC uses a different IPC-2251 draft form for embedded microstrip, rated within 20 % of a field solver for w/h below 1.0. Treat the embedded result as a rough estimate.
Pairs
Microstrip pairs use the IPC-2141 single-ended Z0 with its coupling term, the form the coupling constants were fitted with. The coupling terms are empirical fits with no published validity range: against a 2D field solver the microstrip pair read 2.5 to 4 % low. Effective εr and delay are shown for the single-ended line (Hammerstad and Jensen).
CPWG
Conformal mapping with a lower ground plane, zero copper thickness, side grounds wide, air above. K is evaluated exactly by the arithmetic-geometric mean.
Presets
JLC04161H-7628: 7628 prepreg 0.2104 mm, εr 4.4, 0.035 mm outer copper. OSH Park 4-layer: FR408HR 2113 prepreg 0.1999 mm, Dk 3.61 at 1 GHz, 0.0432 mm outer copper. Both read from the fab pages on 13 October 2026.
Assumes
Rectangular trace, no solder mask on surface lines, a single homogeneous εr at one frequency, smooth copper. The fab builds to its own field solver; send them the target impedance, not just a width.
Sources
FAQ

Questions

On the JLC04161H-7628 stackup (0.2104 mm of 7628 prepreg, εr 4.4, 1 oz outer copper) a 0.37 mm surface microstrip is 50.2 Ω. JLCPCB sizes impedance-controlled orders with its own calculator, so use this to plan routing and check its number before ordering.

The surface microstrip model here (Hammerstad and Jensen) is within about 1 % of a 2D field solver on typical FR-4 lines; the older IPC-2141 form many calculators use reads 3.5 to 6 % low on thin dielectrics. Stripline is within 1 % for normal widths. Embedded microstrip is the least reliable of the closed forms; no verified accuracy figure is given for the version used here. Use these numbers for planning and let the fab or a field solver set the final width.

The surface microstrip result is for bare copper in air. Mask adds dielectric above the trace and lowers Z0. To estimate it, use embedded microstrip with h1 set to h plus the copper plus the mask: OSH Park lists 0.0152 mm of solder resist, and JLCPCB lists a solder mask εr of 3.8.

Coupling only lowers Zdiff below twice Z0 when the gap is small compared with the height. On the JLCPCB outer layer, 0.25 mm traces 0.15 mm apart give 91.8 Ω; moved far apart the same traces approach 2 × 60.6 = 121 Ω, twice the single-trace value of the IPC pair equation. (The surface microstrip mode uses the more accurate Hammerstad and Jensen model and gives 61.4 Ω for the same trace.) Keep the gap constant along the pair, since the impedance follows it.

A 50 Ω surface microstrip on εr 4.4 (0.37 mm over 0.2104 mm) has an effective εr of 3.19 and a delay of 151.2 ps/in (5.95 ps/mm), because part of the field is in air. A stripline in the same material is fully embedded and runs at 177.7 ps/in (7.00 ps/mm). Use the matching figure for each layer when matching lengths across layers.

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