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PCB trace resistance calculator

DC resistance of a copper trace at temperature, with the voltage drop and power at a given current.

Units
Presets
mm
mm
°C
A
Resistance at 25 °C
200.9mΩ
Voltage drop at 1 A
200.9 mV
Power dissipated
200.9 mW
Sheet resistance
502 µΩ
Per square of this copper weight.
Squares (length / width)
400
Cross-section
0.00875 mm²
IPC-2221 rise, outer layer
13.5 °C
Internal layers run hotter: use the trace width calculator.
Method

How this is calculated

R = ρ20 · (1 + 0.00393 · (T − 20)) · L / (w · t)
t = 1.378 mil (35 µm) per oz/ft²
Rs = ρ / t        sheet resistance, Ω per square
V = I · R,  P = I² · R
ΔT = ( I / (0.048 · A^0.725) )^(1 / 0.44)   IPC-2221 external, A in mil²
Copper
Resistivity 1.724 × 10⁻⁸ Ω·m at 20 °C (annealed copper, IACS), coefficient 0.00393 per °C. 1 oz/ft² is taken as 1.378 mil (35 µm).
Assumes
Rectangular cross-section at nominal thickness, DC. Real outer layers are plated up and etched to a trapezoid, so measured resistance can differ by the thickness and width tolerance.
Temperature
Enter the copper temperature, not ambient. The IPC-2221 rise is shown so you can add it to ambient and run again.
Sources
FAQ

Questions

0.49 mΩ per square at 20 °C for 35 µm of annealed copper. A trace of length L and width w has L/w squares, so a 1 in by 10 mil trace is 100 squares and about 49 mΩ. Half-ounce copper is twice that.

Copper rises 0.393 % per °C. A trace measured at 25 °C has 23.1 % more resistance at 85 °C, which matters for current sense paths and long power runs.

Outer layers are plated, so finished copper is often thicker than the base foil, and etching leaves a trapezoid narrower at the top. Both shift resistance by the fab tolerance. For a sense resistor path, use a Kelvin connection instead of relying on the trace.

No, it is DC. At high frequency current crowds toward the surface (skin effect) and resistance rises once the skin depth is smaller than the copper thickness. Switching regulator loops and RF lines need an AC model.

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